For Immediate Release 

Resin Designs, a division of Chase Corporation, announces positive test results for their latest, lowest viscosity ThermoSink 35-7 thermally conductive electronics potting material. 

Recent independent testing has confirmed that ThermoSink 35-7 has met requirements under the testing protocol:

ASTM E595-15 (2021), "Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment” 

Results concluded that ThermoSink 35-7 produces a total mass loss well below the specification of 1% loss. As a result, ThermoSink 35-7 is considered acceptable for use in high-demand aerospace applications where low outgassing standards are a requirement. 

ThermoSink 35-7 specifically has been designed for low viscosity, and superior flow performance making it suitable for higher-speed processing. ThermoSink 35-7 key advantages include:

• Mixed viscosity < 10K CPS 
• Unique filler size and geometry 
• Superior flow and self-leveling properties 
• Less prone to bubble entrapment 
• Capable of high-speed processing 

Chase Corporation, a global leader in the development and manufacture of specialty polymers, are experts in providing PCB protection in the most demanding applications. Chase Corporation was founded in 1946 and has grown to become an innovative manufacturer of advanced protective materials with a global customer base.  

 For further information on Chase ThermoSink please visit: https://chasecorp.com/resindesigns/silicones-products/thermosink/