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Before we look at conformal coating in the 21st Century, it is worth looking at how our industry has changed since the 20th Century and the effect these changes have had on reliability. 

30 years ago, we had:

• Through-hole PCAs with axial components and wide conductor spacing (see fig. 1)
• Round axial components that were easy to conformably coat
• Wide conductor spacing (causing a few problems with dendritic growth)
• Leaded solder
• The widely adopted practice of cleaning before conformal coating

Fig. 1

Now move forward 30 years. In that time, surface mount components have been developed that are predominantly square with sharp edges, conductor spacing has been reduced, and packing densities have increased to levels never dreamt of in the past (see fig. 2). 

When conventional coating methods such as hand spray, total dipping or robotic selective coating don’t provide the protection required, there is always selective dip coating.

What is selective dip conformal coating?

Selective dip coating is a process whereby the substrate rather than globally immerised in the coating, is discreetly coated in desired locales.  The technique in one form or another, has been around for over 25 years and is used with both classic solvent-based coatings and 100% UV cure conformal coatings.

In the days before surface mount printed circuit assemblies, components (such as resistors, diodes, and capacitors) were axial, and printed circuit board components were installed with the “through-hole” method using large conductor spacing. With the advent of integrated circuits, these too were through-hole with good spacing between legs.